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[1]郑 毅,凡纪鹏,邓一坤,等.光敏聚酰亚胺的改性及应用研究进展[J].武汉工程大学学报,2025,47(01):28-36.[doi:10.19843/j.cnki.CN42-1779/TQ.202408011]
　ZHENG Yi,FAN Jipeng,DENG Yikun,et al.Research progress on the modification and applications of photosensitive polyimide[J].Journal of Wuhan Institute of Technology,2025,47(01):28-36.[doi:10.19843/j.cnki.CN42-1779/TQ.202408011]
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光敏聚酰亚胺的改性及应用研究进展
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《武汉工程大学学报》[ISSN:1674-2869/CN:42-1779/TQ]

卷:
47
期数:
2025年01期
页码:
28-36
栏目:
材料科学与工程
出版日期:
2025-02-28

文章信息/Info

Title:
Research progress on the modification and applications of photosensitive polyimide

文章编号:
1674 - 2869（2025）01 - 0028 - 09
作者:
1. 武汉工程大学化学与环境工程学院，新型催化材料湖北省工程研究中心，湖北 武汉 430205；
2. 曼彻斯特城市大学工程学院化学系，曼彻斯特 M15 6BH

Author(s):
1. School of Chemistry and Environmental Engineering，Novel Catalytic Materials of Hubei Engineering Research Center，Wuhan Institute of Technology，Wuhan 430205，China；
2. Department of Chemistry，School of Engineering，Manchester Metropolitan University，Manchester M15 6BH，United Kingdom
关键词:
Keywords:
分类号:
U446
DOI:
10.19843/j.cnki.CN42-1779/TQ.202408011
文献标志码:
A
摘要:
光敏聚酰亚胺（PSPI）具有优异的感光性、机械性以及良好的化学和热稳定性，近年来被广泛应用于先进封装、微电子系统、有机发光二极管显示等新兴领域。首先根据曝光区溶解性的差异详细阐述了目前正性PSPI和负性PSPI的种类、结构与性能；随后从PSPI的结构设计、PSPI制备过程中添加剂的加入、PSPI原料配方的改进3个方面系统分析了PSPI光敏性能的提升策略；紧接着对PSPI在集成电路、微电子、3D打印以及生物医学器件等领域的应用和未来发展趋势进行了全面介绍；最后对PSPI的光敏性、化学稳定性、耐热性、机械性、环保性的进一步优化提出了调整PSPI聚合条件、开发新型光敏剂、增强PSPI抗溶剂性、引入交联剂、优化PSPI制备方法等建设性意见。
Abstract:
In recent years，photosensitive polyimide （PSPI） has been widely employed in emerging fields such as advanced packaging，microelectronics systems，and organic light-emitting diode displays due to its excellent photosensitivity，mechanical properties，and outstanding chemical and thermal stability. In this review，the types，structures and properties of positive PSPIs and negative PSPIs are described in detail according to the differences in solubility in the exposure area. Subsequently，the strategies for improving the photosensitive performance of PSPIs are systematically analyzed from three aspects：the structural design of PSPIs，the addition of additives in the preparation process of PSPIs，and the improvement of PSPI raw material formulations. Then，the applications and future development trends of PSPI in the fields of integrated circuits，microelectronics，3D printing and biomedical devices are comprehensively introduced. Finally，some constructive suggestions for further optimization of photosensitivity，chemical stability，heat resistance，mechanical properties，and environmental friendliness of PSPIs are put forward，including adjusting the polymerization conditions of PSPIs，developing new photosensitizers，enhancing the solvent resistance of PSPIs，introducing crosslinkers，and optimizing the preparation methods of PSPIs.

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备注/Memo

备注/Memo:
收稿日期：2024-08-09
基金项目：2023年工信部高质量发展专项（TC230A076-18）
作者简介：郑 毅，硕士研究生。Email：2908134272@qq.com
*通信作者：邹 菁，博士，教授。Email：jingzou@wit.edu.cn
引文格式：郑毅，凡纪鹏，邓一坤，等. 光敏聚酰亚胺的改性及应用研究进展［J］. 武汉工程大学学报，2025，47（1）：28-36.
更新日期/Last Update: 2025-03-17